COUGAR ELECTRONICS can design and produce high performance air cooled heat sinks for advanced applications.
Air cooled heat sinks allow an exchange between a surface, heated by an electronic component, and the air.
There are two kind of heat sinks :
- Natural convection heat sink : fan-less solutions
- Forced convection heat sink : fan blowing the air inside the fins
Several manufacturing technologies exist :
Following the thermal parameters of the application, COUGAR ELECTRONICS will help you to find the optimal cost / efficiency solution.
Characteristics
Technical datas
- Material: Aluminum 6060/6061/6082
- Thermal resistance: 15 to 35°C/kW
- Surface treatment: anodizing / suretec / nickel plating…
Advantages
- Simplicity
- Cost
Applications
- Natural convection heat sink
- Brazed radiator
- HSHP radiator
Insulated Heat Sink
COUGAR ELECTRONICS is distributing on US market CECLA METAL PROCESS’ unique know-how in the manufacturing of high tension electrical insulated cooling solution.
Technical datas
In some high tension configurations of multi-scale power converters, it’s necessary to use oversized electronic semiconductors in order to respect dielectric norms of the application, particularly in railway application.
An Electrically insulated cooler can avoid the oversizing of the components in multi-scales’ topologies by adding insulation between the component and its cooling system.
Advantages
- Economic on high tension multi-scale converters
- Appropriate shape and dimensions for your component topology
- Appropriate for on-board using, especially in the railway industry
Technical characteristics
- Insulation : up to20kV
- Thermal resistance : 15 to 55°C/kW
- Fire-Smoke qualification : ULV0
Applications
- Natural convection heat sink
- Brazed radiator
- HSHP radiator
Heat Sink with embedded Heat Pipes
COUGAR ELECTRONICS is distributing on US market CECLA METAL PROCESS’ range of HSHP heat sinks. This performing solution allows to reduce weight and improve compactness by spreading the heat with a heat pipe in the base plate of the heat sink.
Application
The typical application of a heat sink with embedded heat pipes is high density power semiconductors. Those heat sinks can also be used to increase the maximum power of a heat sink, without changing the size. The heat pipe by their high thermal conductivity will act as heat spreader and allow all heat sink working better,
Advantages
- Light and compactness
- Performing solution, without change of size
- Able do dissipate high density thermal flux semiconductors